At M&H, additively manufactured components made from AlSi10Mg undergo further machining without being re-clamped after the powder is removed. A segmented substrate plate clamping system combines additive manufacturing and CNC machining into a single, integrated process.
Metal 3D printing is just one part of the process chain. Particularly in the case of complex, topology-optimised components, the subsequent machining process plays a decisive role in ensuring dimensional accuracy, surface quality and process reliability.
M&H currently manufactures topology-optimised components from the aluminium alloy AlSi10Mg. Following the printing process, the components are first automatically deburred in the Solukon SFM-AT1000-S. The system moves the construction platform via two servo-driven rotational axes and combines this movement with targeted vibration. This makes it possible to remove loose powder even from hard-to-reach areas, internal channels and complex geometries.
In conjunction with the SPR-Pathfinder software, the required motion sequences can be calculated on the basis of the CAD data. This reduces the amount of manual programming required, whilst allowing defined cleaning sequences to be replicated for different construction jobs.
Machining without the need for re-alignment
After debinding, the build platform is transferred directly to the machining process. To this end, M&H uses AMF’s segmented substrate plate clamping system. The components remain on the substrate plate during machining. There is no need to remove it beforehand, retighten it or recalibrate it.
This ensures that the original reference points are retained throughout the entire process. At the same time, the number of manual interventions is reduced at a point in the production line where additional clamping operations can lead to positional deviations or increased set-up time.
The substrate plate is held in place by a size 20 mechanical zero-point clamping module. According to AMF, the module provides a holding force of 43 kN and a retraction and locking force of 20 kN. An additional indexing element ensures that the carrier plate is correctly aligned.
The compact clamping system allows for good access to the component. This means that 5-sided machining can be carried out directly on the build platform. The manufacturer states that the complete AMF substrate plate clamping system offers a repeatable positioning accuracy of less than 5 µm.
End-to-end process chain for complex components
The combination of automated powder removal, a defined zero-point interface and mechanical machining on the build platform does not shorten the printing process itself. However, it reduces the number of interfaces, set-up operations and potential sources of error in post-processing.
This offers a decisive advantage, particularly in the case of complex additively manufactured components: the geometry is cleaned and then machined with precision, without unnecessarily disrupting the positional relationship that has already been established.